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| MCRF202 125 kHz Passive RFID Device with Sensor Input Features * * * * * * * * External sensor input Data polarity changes with sensor input condition Read-only data transmission 96- or 128-bits of factory programming user memory (also supports 48- and 64-bit protocols) Operates up to 400 kHz carrier frequency Low-power operation Modulation options: - ASK, FSK, PSK Data Encoding options: - NRZ Direct, Differential Biphase Manchester Biphase Die, Wafer, PDIP or SOIC package option Factory programming and device serialization Package Type PDIP/SOIC VA NC TEST SENSOR 1 2 3 4 8 7 6 5 VB NC VSS VCC Description The MCRF202 is a passive Radio Frequency Identification (RFID) device that provides an RF interface for reading the contents of a user memory array. This device is specially designed to detect the logic state of an external sensor, and alters its data transmissions, based on the condition of the sensor input. The device outputs a normal bit data stream if the sensor input has a logic `1' state, but outputs an inverted data stream for a logic `0' state. In this way, the reader can monitor the state (condition) of the external sensor input by detecting whether the data from the device is a normal or inverted data stream. The device is powered by rectifying the incoming RF carrier signal that is transmitted from the reader. When the device develops sufficient DC voltage, it transmits the contents of its memory array by modulating the incoming RF carrier signal. The reader is able to detect the modulation and decodes the data being transmitted. Code length, modulation option, encoding option, and bit rate are set at the factory to fit the needs of particular applications. The MCRF202 is available in die, wafer, PDIP and SOIC packages. The encoding, modulation, bit rate options, and data fields are specified by the customer and programmed by Microchip Technology Inc. prior to shipment. See Technical Bulletin TB023 for more information on factory serialization (SQTPTM). * * Applications * Insect control * Industrial tagging RF Signal Reader Data MCRF202 External Sensor Switch 2003 Microchip Technology Inc. DS21308E-page 1 MCRF202 Block Diagram Sensor Input Modulation Control Logic Inverter Data VA External Coil and Capacitor Connections VB Clock Generator Mod Rectifier and VCC Circuit AC Clamp VSS Power-On Reset Reset 12-bit Configuration Register Row Decode Baud Rate Timing Counter 128-bit EEPROM Memory Array Column Decode DS21308E-page 2 2003 Microchip Technology Inc. MCRF202 1.0 1.1 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings() Storage temperature ..............................................................................................................................- 65C to +150C Ambient temperature with power applied................................................................................................-40C to +125C Maximum current into coil pads ..............................................................................................................................50 mA NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: AC AND DC CHARACTERISTICS All parameters apply across the specified operating ranges Industrial (I): TA = -40C to +85C unless otherwise noted. Parameter Clock frequency Data retention Coil current (Dynamic) Operating current with no VCC load Operating current with VCC load ICD IDD IDL Sym FCLK Min 100 200 -- -- -- Typ -- -- 50 5 10 Max 400 -- -- -- -- Units kHz Years A A A VCC = 2V No load to VCC pad VCC = 2V VCC load through switch to sensor 25C Conditions Turn-on-voltage (Dynamic) for modulation Input Capacitance SENSOR pull-down SENSOR trigger threshold VAVB VCC CIN RS VS 10 2 -- 400 0.5 -- -- 2 800 1.0 -- -- -- 1200 1.5 VPP VDC pF k V Between VA and VB 2003 Microchip Technology Inc. DS21308E-page 3 MCRF202 2.0 FUNCTIONAL DESCRIPTION 2.1.3 VCC REGULATOR The device contains three major building blocks. They are RF front-end and sensor input, configuration and control logic, and memory sections. The Block Diagram is shown on page 1. The device generates a DC supply voltage from the unregulated coil voltage. The Vcc pin can be used to power a separate low-current device (read range will be affected). 2.1 RF Front-End and Sensor Input 2.1.4 CLOCK GENERATOR The RF front-end of the device includes circuits for rectification of the carrier, VDD (operating voltage), and high-voltage clamping to prevent excessive voltage from being applied to the device. This section also generates a system clock from the incoming carrier signal and modulates the carrier signal to transmit data to the reader. This circuit generates a clock based on the carrier frequency from the reader. This clock is used to derive all timing in the MCRF202, including the baud rate and modulation rate. 2.1.5 POWER-ON RESET 2.1.1 RECTIFIER - AC CLAMP This circuit generates a Power-on Reset when the tag first enters the interrogator field. The Reset releases when sufficient power has developed on the VDD regulator to allow correct operation. The AC voltage generated by the external tuned LC circuit is full wave rectified. This unregulated voltage is used as the maximum DC supply voltage for the rest of the device and for the VCC supply to the external sensor or switch. Any excessive voltage on the tuned circuit is clamped by the internal circuitry to a safe level to prevent damage to the IC. 2.1.6 SENSOR INPUT AND DATA INVERTER 2.1.2 MODULATION CIRCUIT The SENSOR input responds to logic high or logic low voltages to drive the internal inverter on or off. A logic high results in normal tag operation; a logic low at SENSOR input activates an inverter, which inverts the entire data stream prior to modulation. The SENSOR input has an internal pull-down resistor of 800 k (typical). See Figure 2-4 for application details. The MCRF202 sends the encoded data to the reader by AM-modulating the coil voltage across the tuned LC circuit. A modulation transistor is placed between the antenna coil pads (VA and VB). The transistor turns on and off based on the modulation signal. As a result, the amplitude of the antenna coil voltage varies with the modulation signal. See Figure 2-1 for details. FIGURE 2-1: MODULATION SIGNAL AND MODULATED SIGNAL MCRF202 VA Mod. Signal L C Mod. TR VB Amplitude Modulation Signal Modulated Signal (across VA and VB) t DS21308E-page 4 2003 Microchip Technology Inc. MCRF202 2.2 Configuration Register and Control Logic 2.2.3 MODULATION OPTION CB8 and CB9 determine the modulation protocol of the encoded data. The available choices are: * * * * ASK FSK PSK_1 PSK_2 The configuration register determines the operational parameters of the device. It directly controls logic blocks which generate the baud rate, memory size, encoded data, modulation protocol, etc. CB11 is always a zero. Once the array is successfully programmed at the factory, the lock bit CB12 is set. When the lock bit is set, programming and erasing the device becomes permanently disabled. Table 2-1 contains a description of the control register bit functions. When ASK (direct) option is chosen, the encoded data is fed into the modulation transistor without change. When FSK option is chosen, the encoded data is represented by: a) Sets of 10 RF carrier cycles (first 5 cycles higher amplitude, the last 5 cycles lower amplitude) for logic "high" level. Sets of 8 RF carrier cycles (first 4 cycles higher amplitude, the last 4 cycles lower amplitude) for logic "low" level. 4 sets of 10 RF carrier cycles for data `1'. 5 sets of 8 RF carrier cycles for data `0'. 2.2.1 BAUD RATE TIMING OPTION The chip will access data at a baud rate determined by bits CB2, CB3, and CB4 of the configuration register. For example, MOD32 (CB2 = 0, CB3 = 1, CB4 = 1) has 32 RF cycles per bit. This gives the data rate of 4 kHz for the RF carrier frequency of 128 kHz. b) 2.2.2 DATA ENCODING OPTION For example, FSK signal for MOD40 is represented: a) b) This logic acts upon the serial data being read from the EEPROM. The logic encodes the data according to the configuration bits CB6 and CB7. CB6 and CB7 determine the data encoding method. The available choices are: * * * * Non-return to zero-level (NRZ_L) Biphase_S (Differential) Biphase_L (Manchester) Inverted Manchester Refer to Figure 2-2 for the FSK signal with MOD40 option. The PSK_1 represents change in the phase of the modulation signal at the change of the encoded data. For example, the phase changes when the encoded data is changed from `1' to `0', or from `0' to `1'. The PSK_2 represents change in the phase at the change on `1'. For example, the phase changes when the encoded data is changed from `0' to `1', or from `1' to `1'. FIGURE 2-2: ENCODED DATA AND FSK OUTPUT SIGNAL FOR MOD40 OPTION Encoded Data `1' 5 cycles (HI) 5 cycles (LO) Encoded Data `0' 4 cycles (HI) 4 cycles (LO) 40 RF cycles 40 RF cycles 2003 Microchip Technology Inc. DS21308E-page 5 MCRF202 FIGURE 2-3: `1' `0' PSK DATA MODULATION `0' `1' `1' Encoded Data (NRZ_L) PSK_ 1 Change on Data PP PP P P PP PP PP PSK _2 Change on `1' 2.2.4 MEMORY ARRAY LOCK BIT (CB12) 2.4 The CB12 bit must be a `1' for a factory programmed device. Examples of Configuration Settings "88D" CONFIGURATION EXAMPLE 2-1: 2.3 Memory Section The device has 128 bits of one-time programmable (OTP) memory. The user can choose 96 or 128 bits by selecting the CB1 bit in the configuration register. See Table 2-1 for more details. The "88D" (hex) configuration is interpreted as follows: CB12 CB1 "88D" 1000-1000-1101 Referring to Table 2-1, the "88D" configuration represents: Modulation = PSK_1 PSK rate = rf/2 Data encoding = NRZ_L (direct) Baud rate = rf/32 = MOD32 Memory size: 128 bits Programmed device 2.3.1 COLUMN AND ROW DECODER LOGIC AND BIT COUNTER The column and row decoders address the EEPROM array at the clock rate and generate a serial data stream for modulation. This data stream can be up to 128 bits in length. The size of the data stream is user programmable with CB1 and can be set to 96 or 128 bits. Data lengths of 48 and 64 bits are available by programming the data twice in the array, end-to-end. The column and row decoders route the proper voltage to the array for programming and reading. In the programming modes, each individual bit is addressed serially from bit 1 to bit 128. EXAMPLE 2-2: "80A" CONFIGURATION The "80A" (hex) configuration is interpreted as follows: CB12 CB1 "80A" 1000-0000-1010 The MSB corresponds to CB12 and the LSB corresponds to CB1 of the configuration register. Therefore, we have: CB12=1 CB8=0 CB4=1 CB11=0 CB7=0 CB3=0 CB10=0 CB6=0 CB2=1 CB9=0 CB5=0 CB1=0 Referring to Table 2-1, the "80A" configuration represents: Programmed device, FSK protocol, NRZ_L (direct) encoding, MOD50 (baud rate = rf/50), 96 bits. DS21308E-page 6 2003 Microchip Technology Inc. MCRF202 TABLE 2-1: CONFIGURATION REGISTER CB7 CB6 CB5 CB4 CB3 CB2 CB1 ARRAY SIZE CB1 = 1 128-bit user array CB1 = 0 96-bit user array CB12 CB11 CB10 CB9 CB8 TIMING CB2 0 0 0 0 1 1 1 1 CB5 = 0 CB3 0 0 1 1 0 0 1 1 CB4 0 1 0 1 0 1 0 1 Rate MOD128 MOD100 MOD80 MOD32 MOD64 MOD50 MOD40 MOD16 NOT USED DATA ENCODING CB6 = 0; CB7 = 0 NRZ_L (Direct) CB6 = 0; CB7 = 1 Biphase_S (Differential) CB6 = 1; CB7 = 0 Biphase_L (Manchester) CB6 = 1; CB7 = 1 (Inverted Manchester) MODULATION OPTIONS CB8 = 0; CB9 = 0 FSK 0 = Fc/8, 1 = Fc/10 CB8 = 0; CB9 = 1 Direct CB8 = 1; CB9 = 0 PSK_1 (phase change on change of data) CB8 = 1; CB9 = 1 PSK_2 (phase change at beginning of a one) PSK RATE OPTION CB10 = 1 clk/4 carrier CB10 = 0 clk/2 carrier (NOT USED) CB11 = 0 ARRAY LOCK BIT CB12 = 1 2003 Microchip Technology Inc. DS21308E-page 7 MCRF202 FIGURE 2-4: TYPICAL APPLICATION CIRCUITS Using MCRF202 with an external passive switch or sensor From Oscillator I 125 kHz Pad VA L 4.91 mH (L) 330 pF (C) Pad VB To Reader Data Detection Circuit RF Carrier Signal Input capacitance: 2 pF Vss Vcc SENSOR External Switch or Sensor Data C 1 = ------------------- = 125 kHz f res 2 LC MCRF202 Device Output External Switch CLOSED (Logic "1" in SENSOR Input):Normal Data Stream External Switch OPEN (Logic "0" in SENSOR Input): Inverted Data Stream Using MCRF202 with an external, self-powered system From oscillator I 125 kHz Pad VA L 4.91 mH (L) 330 pF (C) Pad VB To Reader Data Detection Circuit RF Carrier Signal Input capacitance: 2 pF Vss Vcc SENSOR Self-Powered External System Data C 1 f = ------------------- = 125 kHz res 2 LC MCRF202 Device Output Logic "1" in SENSOR Input: Logic "0" in SENSOR Input: Normal Data Stream Inverted Data Stream Using MCRF202 with a low-resistance pull-down From oscillator I 125 kHz Pad VA L 4.91 mH (L) 330 pF (C) Pad VB To Reader Data Detection Circuit RF Carrier Signal Input capacitance: 2 pF Vss Vcc SENSOR SW External Resistor Data C 1 fres = ------------------- = 125 kHz 2 LC MCRF202 Device Output External Switch CLOSED (Logic "1" in SENSOR Input): Normal Data Stream External Switch OPEN (Logic "0" in SENSOR Input): Inverted Data Stream DS21308E-page 8 2003 Microchip Technology Inc. MCRF202 3.0 MECHANICAL SPECIFICATIONS FOR DIE AND WAFER DIE PLOT VCC SENSOR TEST TABLE 3-1: PAD COORDINATES (M) Passivation Openings FIGURE 3-1: VSS Pad Name VA VB VSS VCC SENSOR TEST Pad Width 90.0 90.0 105.3 90.0 90.0 90.0 Pad Height 90.0 90.0 112.5 90.0 90.0 90.0 Pad Center X 427.50 -408.60 -417.60 -164.70 69.30 325.35 Pad Center Y -734.17 -734.17 722.47 723.82 723.82 723.82 Note 1: All coordinates are referenced from the center of the die. 2: Die size: 1.1215 mm x 1.7384 mm. TABLE 3-2: Name VB VA PAD FUNCTION TABLE Function Coil and capacitor connections Device ground DC supply out from device Sensor input Do Not Connect, Test pin VA, VB VSS VCC SENSOR TEST 2003 Microchip Technology Inc. DS21308E-page 9 MCRF202 TABLE 3-3: DIE MECHANICAL DIMENSIONS Specifications Bond pad opening Die backgrind thickness Min -- -- -- -- -- -- Die backgrind thickness tolerance Die passivation thickness (multilayer) Die Size: Die size X*Y before saw (step size) Die size X*Y after saw Note 1: 2: 3: 4: -- -- -- -- -- Typ 3.5 x 3.5 89 x 89 7 177.8 11 279.4 -- -- 0.9050 44.15 x 68.44 42.58 x 66.87 Max -- -- -- -- -- -- 1 25.4 -- -- -- Unit mil m mil m mil m mil m m mil mil Note 4 -- -- Comments Note 1, Note 2 Sawed 6" wafer on frame (option = WF) Note 3 Unsawed wafer (option = W) Note 3 5: The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at least 0.1 mil. Metal Pad Composition is 98.5% Aluminum with 1% Si and 0.5% Cu. As the die thickness decreases, susceptibility to cracking increases. It is recommended that the die be as thick as the application will allow. The Die Passivation thickness can vary by device depending on the mask set used: - Layer 1: Oxide (undopped oxide 0.135 m) - Layer 2: PSG (dopped oxide, 0.43 m) - Layer 3: Oxynitride (top layer, 0.34 m) The conversion rate is 25.4 m/mil. Notice: Extreme care is urged in the handling and assembly of die products since they are susceptible to mechanical and electrostatic damage. TABLE 3-4: Wafer Diameter WAFER MECHANICAL SPECIFICATIONS Specifications Min -- -- -- -- Typ 8 80 14,000 24 Max -- -- -- -- Unit inch m die wafer 150 mm Comments Die separation line width Dice per wafer Batch size DS21308E-page 10 2003 Microchip Technology Inc. MCRF202 4.0 FAILED DIE IDENTIFICATION 6.0 Every die on the wafer is electrically tested according to the data sheet specifications and visually inspected to detect any mechanical damage such as mechanical cracks and scratches. Any failed die in the test or visual inspection is identified by black colored inking. Therefore, any die covered with black ink should not be used. The ink dot specification: * Ink dot size: minimum 20 m x 20 m * Position: central third of die * Color: black NOTICE ON DIE AND WAFER HANDLING The device is very susceptible to Electrostatic Discharge (ESD). ESD can cause critical damage to the device. Special attention is needed during the handling process. Any ultraviolet (UV) light can erase the memory cell contents of an unpackaged device. Fluorescent lights and sun light can also erase the memory cell although it takes more time than UV lamps. Therefore, keep any unpackaged devices out of UV light and also avoid direct exposure from strong fluorescent lights and sun light. Certain integrated circuit (IC) manufacturing, chip-onboard (COB) and tag assembly operations may use UV light. Operations such as backgrind, de-tape, certain cleaning operations, epoxy or glue cure should be done without exposing the die surface to UV light. Using x-ray for die inspection will not harm the die, nor erase memory cell contents. 5.0 WAFER DELIVERY DOCUMENTATION Each wafer container is marked with the following information: * * * * * * Microchip Technology Inc. MP Code Lot Number Total number of wafer in the container Total number of good dice in the container Average die per wafer (DPW) Scribe number of wafer with number of good dice. 2003 Microchip Technology Inc. DS21308E-page 11 MCRF202 7.0 7.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW MCRF202 XXXXXNNN 0025 8-Lead SOIC (150 mil) Example: XXXXXXX XXXYYWW NNN MCRF202 XXX0025 NNN Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. DS21308E-page 12 2003 Microchip Technology Inc. MCRF202 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c L A1 eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2003 Microchip Technology Inc. DS21308E-page 13 MCRF202 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21308E-page 14 2003 Microchip Technology Inc. MCRF202 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape(R) or Microsoft(R) Internet Explorer. Files are also available for FTP download from our FTP site. SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits. The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 042003 Connecting to the Microchip Internet Web Site The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events 2003 Microchip Technology Inc. DS21308E-page 15 MCRF202 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: MCRF202 Questions: 1. What are the best features of this document? Y N Literature Number: DS21308E FAX: (______) _________ - _________ 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21308E-page 16 2003 Microchip Technology Inc. MCRF202 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device -X Temperature Range /XXX Package XXX Configuration Examples: a) MCRF202-I/WQ99 = 125 kHz, industrial temperature, wafer package, factory programmed, sensor input, "Q99" sample customer code. Device: MCRF202 = 125 kHz MicroID tag with Sensor input, 96/128-bit Temperature Range: I = -40C to +85C Package: WF W S WFB WB SB SN P = = = = = = = = Sawed wafer on frame (7 mil backgrind) Wafer (11 mil backgrind) Dice in waffle pack (11 mil backgrind) Sawed, Bumped wafer on frame (11 mil backgrind) Bumped wafer (11 mil backgrind) Bumped die in waffle pack (11 mil backgrind) Plastic SOIC (150 mil body) 8-lead Plastic DIP (300 mil body) 8-lead Configuration: SQTP Customer Identifier. Assigned during the SQTP (factory programming) approval process. Usually QXX where XX is an integer used to track customer data files. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21308E-page17 MCRF202 NOTES: DS21308E-page18 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003 . The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2003 Microchip Technology Inc. DS21308E-page 19 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 China - Beijing Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. 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Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393 Germany Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Phoenix 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 China - Shunde Room 401, Hongjian Building No. 2 Fengxiangnan Road, Ronggui Town Shunde City, Guangdong 528303, China Tel: 86-765-8395507 Fax: 86-765-8395571 Italy Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 San Jose 1300 Terra Bella Avenue Mountain View, CA 94043 Tel: 650-215-1444 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Netherlands P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 11/24/03 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 DS21308E-page 20 2003 Microchip Technology Inc. |
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